Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2001-01-24
2001-11-20
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S678000
Reexamination Certificate
active
06320259
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device, and a manufacturing apparatus for and a method of manufacturing the semiconductor device.
Conventionally, in manufacturing a semiconductor device, a die bonding process used. A semiconductor chip, after a dicing process, is placed on a lead frame via a bonding material made of a film material, and is then bonded to the lead frame. In this die bonding process, usually, before the semiconductor chip is placed, a strip-like film material with an adhesive applied to both sides of a base material, is cut into a predetermined size and shape, and, thereafter, is stuck onto the lead frame.
FIG. 7
is a view schematically showing a construction f or forming a film piece having a predetermined size and shape out of a strip-like die bonding film in a die bonding process, incorporated into a conventional semiconductor manufacturing apparatus. In this construction, when a feed roller
65
makes a predetermined rotation, a die bond film
61
is guided to a guide roller
63
and a guide plate
64
from a reel guide
62
, and, is fed between a female blade member
71
and a male blade member
72
in a film piece forming unit
70
. The male blade member
72
is slidably moved along the direction of an arrow D
4
, along an inner wall portion of a retaining member
74
. When the male blade member
72
moves toward the female blade member
71
, the die bonding film
61
is cut. Thus, a rectangular film piece
61
a
having a predetermined length is formed out of the die bonding film
61
.
The film piece
61
a
is picked up from the distal surface of the male blade member
72
, and then, as shown in
FIG. 8
, is carried and stuck on a lead frame
85
. Thereafter, the lead frame
85
is carried at a pitch, and then, a semiconductor chip
81
carried by another unit (not shown) is placed on the film piece
61
a,
and thereby, is bonded onto the lead frame
85
.
According to the aforementioned conventional construction, a length of the film piece
61
a
is determined by a distance from the end of the die bonding film
61
to a cut position by the film forming unit
70
. Thus, the accuracy of the length of the film piece depends upon accuracy in the feed operation of the die bonding film
61
. For this reason, it is difficult to achieve accurate control of the length of the film piece
61
a.
When a semiconductor device (e.g., stacked package, etc.) including a structure particularly requiring size accuracy is manufactured, there is a problem that it is hard to secure minimum quality.
Further, according to the aforementioned conventional construction, width of the film piece
61
a
is determined by the width of the die bonding film
61
. For this reason, in the case of changing the width of the film piece
61
a in accordance with the size of the semiconductor chip
81
, the die bonding film
61
must be replaced with another die bonding film. This replacement is a great hindrance to effectively performing the die bonding process. In this case, regarding the width of the film piece
61
a,
preferably, a tolerance of 0.15 or less is required. In order to obtain the aforementioned accuracy, there is a need for accuracy control of the die bonding film
61
.
Furthermore, according to the aforementioned conventional construction, in the case of manufacturing a semiconductor device having a BOC (Board on Chip) structure such that an electrode provided on a back side of a semiconductor chip, and the back side of the lead frame are bonded by a wire inserted into a through-hole in the lead frame, and, thereafter, a portion facing a through-hole of the semiconductor chip and the wire are sealed with a resin, the film piece is stuck onto both sides of the through-hole. Therefore, two film pieces are required with respect to one semiconductor chip. For this reason, the time spent in manufacturing is extended. Moreover, according to the structure of the semiconductor device, there is another problem. In the surface facing the through-hole of the semiconductor chip, and in a process of sealing the wire with a resin, the resin material, such as a potting resin, leaks from a clearance between the ends of the two film pieces. That is, there is a region where no bond is made between the chip and the lead frame.
SUMMARY OF THE INVENTION
The present invention has been made taking the aforementioned problem in the prior art into consideration. It is, therefore, an object of the present invention to provide semiconductor manufacturing apparatus and method which can simplify a size accuracy control of a die bond film piece, and can readily form the die bond film piece into arbitrary dimension and shape in a die bond process.
Moreover, another object of the present invention is to provide a semiconductor device having a BOC structure which can reduce a time spent for manufacture, and is capable of preventing a leakage of a resin material in a seal process.
In order to achieve these objects, in a first aspect of the present invention, there is provided a semiconductor device which is constructed in a manner that a semiconductor chip is bonded on a lead frame having a through-hole extending in a thickness direction via a die bond film piece having a predetermined size and shape, and a portion facing the through-hole of the semiconductor chip and a wire are sealed after an electrode provided on a back side of the semiconductor chip and a back side of the lead frame are bond by the wire inserting into the through-hole, wherein the film piece being formed with a hole having an inner circumferential shape along an outer periphery of the through-hole of the lead frame, and being positioned on the lead frame so that the hole surrounds the circumstance of the through-hole of the lead frame.
In a second aspect of the present invention, there is provided a semiconductor manufacturing apparatus having a construction for forming a film piece to bond a semiconductor chip on a lead frame out of a die bond film in a die bond process of semiconductor chip, and stick the film piece onto a predetermined position on the lead frame, comprising: film feed means for sequentially feeding the die bond film; and film piece forming means for forming a die bond film piece having a predetermined shape and dimension out of the die bond film fed by the film feed means, the film piece forming means including: a male blade member which has a cutting blade at least one portion at circumferential edges on its distal portion and is moved so as to be reciprocated in a predetermined direction; and a female blade member which has an opening portion at the distal portion side of the male blade member and has a receiving blade corresponding to the cutting blade of the male blade member at an inner circumferential edge of the opening portion, wherein the male blade member and the female blade member are alterable, and thereby a shape and dimension of the film piece defined by their cutting blade and receiving blade can be arbitrarily set.
In a third aspect of the present invention, there is provided the semiconductor manufacturing apparatus, wherein the film piece forming means is arranged so that the distal end surface of the male blade member is oriented downward in a substantially vertical direction, and a receiving case is arranged on the lower side of the film piece forming means so as to receive a film scrap which is punched out of the die bond film, and drops therein via the opening portion of the female blade member.
In a fourth aspect of the present invention, there is provided the semiconductor manufacturing apparatus, wherein the film piece forming means is arranged so that the distal end surface of the male blade member is oriented upward in a substantially vertical direction, and so that the formed film piece is held on the distal end surface, and further includes a carrying means for attracting and holding the film piece held on the distal end surface of the male blade member by a pick-up head, and carrying it onto a predetermined position on the lead frame.
In a fifth
Ishitsuka Masahiro
Yamauchi Shunji
Leydig , Voit & Mayer, Ltd.
Mitsubishi Denki & Kabushiki Kaisha
Nelms David
Nhu David
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