4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Marvin Lo

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Aluminum cap with electroless nickel/immersion gold

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Aluminum cap with electroless nickel/immersion gold

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Process for manufacturing an integrated circuit system

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2953113

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