Aluminum cap with electroless nickel/immersion gold

Details Aluminum cap with electroless nickel/immersion gold Aluminum cap with electroless nickel/immersion gold

2006-07-25

2006-07-25

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C438S613000

Reexamination Certificate

active

07081372

ABSTRACT:
A method of forming a solder bump (and the resulting solder bump structure), comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal bond pad. The patterned cover layer opening including side walls. A metal cap layer is formed over at least the exposed portion of the metal bond pad and the patterned cover layer side walls. A solder bump is formed over the metal cap layer.

REFERENCES:
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patent: 6426281 (2002-07-01), Lin et al.
patent: 6452270 (2002-09-01), Huang
patent: 6506672 (2003-01-01), Dagenais et al.
patent: 6521996 (2003-02-01), Seshan
patent: 6780761 (2004-08-01), Wu et al.
patent: 1148548 (2001-10-01), None

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