4. Abrading
  5. Flexible-member tool, per se
  6. Interrupted or composite work face

Markus Naujok

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Composite intermetal dielectric structure including low-k...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Dual damascene structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Finishing pad design for multidirectional use

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Finishing pad design for multidirectional use

Abrading – Flexible-member tool – per se – Interrupted or composite work face
Reexamination Certificate

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Methods of forming integrated circuit devices having metal...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Profile ID: LFUS-PAI-P-2638882

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