4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Markus K. Liebhard

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Chip size image sensor bumped package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Chip size image sensor bumped package fabrication method

Metal fusion bonding – Process – Plural joints
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Chip size image sensor in wirebond package with step-up ring...

Radiant energy – Photocells; circuits and apparatus – Housings
Reexamination Certificate

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Chip size image sensor wirebond package fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Ground ring for a metal electronic package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-1899130

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