4. Metal fusion bonding
  5. With means to remove, compact, or shape applied flux or filler

Mark A. Kwoka

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Chip carrier soldering pallet

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent

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Coveyor for vapor phase reflow system

Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor
Patent

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Method for cleaning semiconductor wafers to improve dice to subs

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent

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Method of manufacturing a plated electronic termination

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-329772

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