Chip carrier soldering pallet

Details Chip carrier soldering pallet Chip carrier soldering pallet

1987-09-30

1989-01-31

Godici, Nicholas P.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

269903, 228 57, 228 37, B23K 100

Patent

active

048010650

ABSTRACT:
A pallet for conveying a plurality of ceramic leadless chip carriers (LCC) through an automated wave soldering machine. The pallet includes recesses formed to receive and contain the LDD's with the lid of the LCC facing into the recess. This results in protecting the lids from the molten solder. Additionally, the recesses are formed in a diamond orientation with a solderable pin placed at the trailing apex of each recess. Both the pin and the diamond orientation prevents solder build up on the trailing conductive pads, resulting in enhancing the coplanarity of the solder on the pads.

REFERENCES:
patent: 4201374 (1980-05-01), Gras
patent: 4614294 (1986-09-01), Weaver
patent: 4666077 (1987-05-01), Rahn et al.
patent: 4667868 (1987-05-01), Decker et al.
patent: 4679720 (1987-07-01), Sedrick, Jr. et al.
patent: 4720034 (1988-01-01), Lee

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