Method for cleaning semiconductor wafers to improve dice to subs

Details Method for cleaning semiconductor wafers to improve dice to subs Method for cleaning semiconductor wafers to improve dice to subs

1996-11-20

1998-11-10

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

216 79, B08B 700

Patent

active

058337580

ABSTRACT:
A method of plasma cleaning semiconductor wafers for subsequent soldering the dice cut from the semiconductor wafers to a substrate. The plasma cleaning removes all contaminants such that the semiconductor dice has improved solderability.

REFERENCES:
patent: 4797178 (1989-01-01), Bui et al.
patent: 5252181 (1993-10-01), Dutartre
patent: 5451263 (1995-09-01), Linn et al.

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