Marino Cellai

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High reliability metal and resin container for a semiconductor d

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Method and package for dissipating heat generated by an integrat

Fishing – trapping – and vermin destroying
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Method for manufacturing plastic encapsulated semiconductor devi

Fishing – trapping – and vermin destroying
Patent

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Molded body incorporating heat dissipator

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-63822

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