High reliability metal and resin container for a semiconductor d

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357 74, 357 81, H01L 2312

Patent

active

047121270

ABSTRACT:
A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.

REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 4132856 (1979-06-01), Hutchinson et al.
patent: 4190735 (1980-02-01), Checki, Jr.
patent: 4270138 (1981-05-01), Desmond

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