Patent
1983-11-29
1987-12-08
Davie, James W.
357 74, 357 81, H01L 2312
Patent
active
047121270
ABSTRACT:
A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.
REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 4132856 (1979-06-01), Hutchinson et al.
patent: 4190735 (1980-02-01), Checki, Jr.
patent: 4270138 (1981-05-01), Desmond
Cellai Marino
Cognetti De Martiis Carlo
Colombo Piero
Davie James W.
SGS-ATES Componenti Elettronici SpA
LandOfFree
High reliability metal and resin container for a semiconductor d does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High reliability metal and resin container for a semiconductor d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High reliability metal and resin container for a semiconductor d will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-24534