Method for manufacturing plastic encapsulated semiconductor devi

Details Method for manufacturing plastic encapsulated semiconductor devi Method for manufacturing plastic encapsulated semiconductor devi

1987-08-27

1989-12-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29848, 29856, 174 522, H01L 2160, H01L 21449, H01L 21603

Patent

active

048883077

ABSTRACT:
A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.

REFERENCES:
patent: 3606673 (1971-09-01), Overman
patent: 4451973 (1984-06-01), Tateno et al.
Translation of Japanese Kokai Patent Publication No. 59-65437.
Hull, John J., "Transfer Molding Old Solution to New Problems", Insulation/Circuits, Oct. 1981, pp. 19-23.

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