Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
Inventor
active
Adhesive and encapsulant material with fluxing properties
Anisotropic conductive adhesive and encapsulant material
Flip-chip package for integrated circuits
Integrated circuit package having a face-to-face IC chip arrange
Thermally conducting adhesive containing aluminum nitride
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Profile ID: LFUS-PAI-P-90270