Flip-chip package for integrated circuits

Details Flip-chip package for integrated circuits Flip-chip package for integrated circuits

1990-08-22

1991-05-28

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 72, 357 80, H01L 2328, H01L 3902

Patent

active

050196731

ABSTRACT:
A flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an array of bumped pads which fill an array of matching conductive through holes on the chip carrier and securely couple thereto. The chip carrier includes an array of bumped contacts on its back surface which correspond to the bumped pads of the flip-chip. The transfer over molding of the integrated circuit assembly provides a layer of epoxy around the exposed surfaces of the flip-chip providing an environmentally protected and removable integrated circuit package.

REFERENCES:
patent: 3331912 (1967-07-01), Stricker et al.
patent: 3689804 (1972-09-01), Ishihama et al.
patent: 4552422 (1985-11-01), Bennett et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4922377 (1990-05-01), Matsumoto et al.
patent: 4975765 (1990-12-01), Ackermann et al.

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