Adhesive and encapsulant material with fluxing properties

Details Adhesive and encapsulant material with fluxing properties Adhesive and encapsulant material with fluxing properties

1990-09-27

1992-07-07

James, Andrew J.

357 80, H01L 2314, H01L 2330

Patent

active

051287463

ABSTRACT:
An adhesive material 120 including a fluxing agent is applied to either a substrate 100 having a metallization pattern 110 or a solder bumped electrical component 130. The component 130 is positioned on the substrate 110 and the solder bump 140 is reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder 140 to the substrate metallization pattern 110, and the adhesive material 120 is cured to mechanically interconnect and encapsulate the substrate 110 to the component 130.

REFERENCES:
patent: 4448847 (1984-05-01), Bell et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4855001 (1989-08-01), Damico et al.
patent: 4980086 (1990-12-01), Hiraiwa et al.
Gabrykewicz, Sangupta, Thuruthumely and Frazee, "Glob top Material Selection for Flip Chip Devices", Proceedings of the 1986 International Symposium for Microelectronics, 1986, pp. 707-713.

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