Method and system for chip-to-package interconnection

Details Method and system for chip-to-package interconnection Method and system for chip-to-package interconnection

2005-10-11

2005-10-11

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S117000, C257S787000

Reexamination Certificate

active

06953707

ABSTRACT:
According to one embodiment of the invention, a method includes providing a semiconductor chip, providing a substrate, forming a plurality of cantilevered springs outwardly from either the semiconductor chip or the substrate, engaging the cantilevered springs with respective contact pads on either the semiconductor chip or the substrate with a fixture, encapsulating the semiconductor chip and cantilevered springs with a molding, and curing the molding.

REFERENCES:
patent: 6184587 (2001-02-01), Khandros et al.
patent: 2004/0102064 (2004-05-01), Mathieu

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