4. Metal fusion bonding
  5. Process
  6. Plural joints

Manjit Dhindsa

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Electronic packaging apparatus and method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Thermally coupling an integrated heat spreader to a heat...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Thermally coupling an integrated heat spreader to a heat...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2371174

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