Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-01-09
2007-01-09
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S122000, C257SE21499
Reexamination Certificate
active
10815185
ABSTRACT:
An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
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Deppisch Carl L.
Dhindsa Manjit
Fitzgerald Thomas J
Norwil Mark
Schaenzer Matthew J.
Geyer Scott B.
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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