Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2008-04-29
2008-04-29
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S234100, C228S246000
Reexamination Certificate
active
10914359
ABSTRACT:
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
REFERENCES:
patent: 4995546 (1991-02-01), Regnault
patent: 6324072 (2001-11-01), Lorenz et al.
patent: 2002/0043402 (2002-04-01), Juskey et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2002/0114963 (2002-08-01), Petkie
patent: 2005/0280142 (2005-12-01), Hua et al.
patent: 2006/0051898 (2006-03-01), Lu et al.
patent: 2006/0227510 (2006-10-01), Fitzgerald et al.
Dhindsa Manjit
Fitzgerald Thomas J.
Renfro Tim A.
Schaenzer Matthew J.
Trivedi Vaibhav P.
Intel Corporation
Stoner Kiley
Trop Pruner & Hu P.C.
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