4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Luu Nguyen

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Arrayable, scaleable, and stackable molded package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Device and method for providing a true semiconductor die to...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
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Electrical interconnect with minimal parasitic capacitance

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Low cost die sized module for imaging application having a...

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
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Method and apparatus for forming a plastic chip on chip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Profile ID: LFUS-PAI-P-2030685

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