4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Lim T. Beng

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Packaged semiconductor device having stress absorbing film

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaged semiconductor device having stress absorbing film

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaged semiconductor device utilizing leadframe attached on a

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-136993

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