4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Lien-Chi Chan

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active

Flip-chip bumping structure with dedicated test pads on...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Heat sink with collapse structure and semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat sink with collapse structure for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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IC card type circuit module

Recording – communication – or information retrieval equipment – Computer – data processor equipment – Element or attachment
Design Patent

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IC card type circuit module

Recording – communication – or information retrieval equipment – Computer – data processor equipment – Element or attachment
Design Patent

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Profile ID: LFUS-PAI-P-2440257

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