4. Synthetic resins or natural rubbers -- part of the class 520 ser
  5. Synthetic resins
  6. Processes of preparing a desired or intentional composition...

Lejun Wang

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Microelectronic or optoelectronic package having a...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Microelectronic or optoelectronic package having a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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No-flow reworkable epoxy underfills for flip-chip applications

Organic compounds -- part of the class 532-570 series – Organic compounds – Heterocyclic carbon compounds containing a hetero ring...
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Polybenzoxazine based wafer-level underfill material

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Polybenzoxazine based wafer-level underfill material

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Profile ID: LFUS-PAI-P-2041529

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