Microelectronic or optoelectronic package having a...

Details Microelectronic or optoelectronic package having a... Microelectronic or optoelectronic package having a...

2005-05-31

2005-05-31

Sellers, Robert (Department: 1712)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C174S258000, C174S259000, C257S788000, C257S790000

Reexamination Certificate

active

06899960

ABSTRACT:
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

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