Microelectronic or optoelectronic package having a...

Details Microelectronic or optoelectronic package having a... Microelectronic or optoelectronic package having a...

2007-02-20

2007-02-20

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000

Reexamination Certificate

active

11099907

ABSTRACT:
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

REFERENCES:
patent: 4619500 (1986-10-01), Ahne et al.
patent: 5543516 (1996-08-01), Ishida
patent: 5900447 (1999-05-01), Ishida
patent: 6143467 (2000-11-01), Hsu et al.
patent: 6225440 (2001-05-01), Ishida
patent: 6376080 (2002-04-01), Gallo
patent: 6437026 (2002-08-01), Garrett
patent: 6620905 (2003-09-01), Musa
patent: 6727594 (2004-04-01), Wang et al.
patent: 6743852 (2004-06-01), Dershem et al.
patent: 6861285 (2005-03-01), Dias
patent: 6902954 (2005-06-01), Shi
patent: 7059048 (2006-06-01), Koning et al.
patent: 2002/0128354 (2002-09-01), Garrett
patent: 2003/0052414 (2003-03-01), Cowens et al.
patent: 2003/0080437 (2003-05-01), Gonzalez et al.
patent: 2003/0109080 (2003-06-01), Dias
patent: 2003/0122241 (2003-07-01), Wang et al.
patent: 2003/0125551 (2003-07-01), Dershem et al.
patent: 2005/0028361 (2005-02-01), Yin et al.
patent: 2006/0121646 (2006-06-01), Koning et al.
patent: 2006/0134901 (2006-06-01), Chaware et al.
patent: 2006/0197236 (2006-09-01), Basheer et al.
patent: 2006/0199301 (2006-09-01), Basheer et al.

Affiliated with

Also associated with

Rating

Microelectronic or optoelectronic package having a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic or optoelectronic package having a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic or optoelectronic package having a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3875154