4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Lee Wang Lai

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method for fabricating a semiconductor package with multi...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for fabricating semiconductor component with multi...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor component having multi layered leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Stacked device package for peripheral and center device pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Stacked die package for peripheral and center device pad...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lee Wang Lai does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Lee Wang Lai, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lee Wang Lai will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2761253

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure