4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Larry Eugene Mosley

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Flip-chip on flex for high performance packaging applications

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Flip-chip on flex for high performance packaging applications

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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High performance capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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High performance capacitor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate

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Methods for forming a high performance capacitor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2460697

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