4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Kwan Jai Lee

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active

Multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Thin stacked package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Thin stacked package and manufacturing method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-775171

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