4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Kurt Raab

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Apparatus for processing flexible tape for microelectronic...

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Methods of making compliant interfaces and microelectronic...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Microelectronic components with frangible lead sections

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Multiple part compliant interface for packaging of a semiconduct

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Transferable resilient element for packaging of a...

Stock material or miscellaneous articles – Layer or component removable to expose adhesive
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Profile ID: LFUS-PAI-P-1632228

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