Semiconductor package structure and method for manufacturing...

Details Semiconductor package structure and method for manufacturing... Semiconductor package structure and method for manufacturing...

2008-05-13

2008-05-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S048000, C438S026000, C438S022000, C438S667000, C438S668000, C257S433000, C257S434000, C257SE21597, C257S621000, C257S774000

Reexamination Certificate

active

11294599

ABSTRACT:
A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surface; pad extension traces are electrically connected to the pads; the via holes penetrate the chip and are electrically connected to the pad extension traces and exposed out of side surfaces of the semiconductor package structure; the lid is adhered onto the active surface of the chip; and the plurality of metal traces is disposed on the back surface of the chip, electrically connected to the plurality of via holes, and used to define a plurality of solder pads thereon. The present invention also provides a method for manufacturing the semiconductor package structure.

REFERENCES:
patent: 7221051 (2007-05-01), Ono et al.
patent: 2002/0019069 (2002-02-01), Wada
patent: 2003/0113979 (2003-06-01), Bieck et al.

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