4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Responsive to electromagnetic radiation

Kuang-Shin Lee

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Camera module

Television – Camera – system and detail – Support or housing
Reexamination Certificate

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Chip on photosensitive device package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Image sensor and fabricating method thereof

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Package structure for optical image sensing integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Process for manufacturing photosensitive module

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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Profile ID: LFUS-PAI-P-2827546

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