Process for manufacturing photosensitive module

Details Process for manufacturing photosensitive module Process for manufacturing photosensitive module

2005-07-26

2005-07-26

Smith, Brad (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S065000, C438S066000

Reexamination Certificate

active

06921681

ABSTRACT:
A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.

REFERENCES:
patent: 6249034 (2001-06-01), Li
patent: 6534340 (2003-03-01), Karpman et al.

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