Fabrication method for printed circuit board

Details Fabrication method for printed circuit board Fabrication method for printed circuit board

2008-06-10

2008-06-10

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

C029S847000

Reexamination Certificate

active

07384566

ABSTRACT:
A fabrication method for PCBs. The method includes providing a substrate having a layout area and a periphery area around the layout area on a surface, forming a patterned wiring layer, having a bus line in the periphery area, a plurality of pads in the layout area, a plurality of bridge lines providing electrical connection between the pads, and a plating line electrically connecting the bus line and pads, overlying the substrate, forming a patterned solder mask over the substrate and wiring layer, the patterned solder mask having a plurality of first openings respectively exposing the pads and plating a metal layer respectively overlying the pads, forming a plurality of second openings respectively exposing the bridge lines between the pads, and removing the exposed bridge lines.

REFERENCES:
patent: 6312614 (2001-11-01), Arimitsu et al.
patent: 6319750 (2001-11-01), Huang et al.
patent: 6399417 (2002-06-01), Lee et al.
patent: 2003/0075792 (2003-04-01), Ruhland
patent: 07106370 (1995-04-01), None

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