Leadframe with die pad and leads corresponding thereto

Details Leadframe with die pad and leads corresponding thereto Leadframe with die pad and leads corresponding thereto

2008-06-05

2010-10-12

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23037, C257SE23043, C257SE23051, C257SE23040, C257SE23124, C257SE23024, C257SE23052, C257S666000, C257S668000, C257S696000, C257S691000, C257S690000, C257S698000, C257S667000, C257S783000, C257S678000, C257S670000, C257S692000

Reexamination Certificate

active

07812431

ABSTRACT:
A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.

REFERENCES:
patent: 5519576 (1996-05-01), Moore
patent: 5532905 (1996-07-01), Moore
patent: 5973407 (1999-10-01), Tzu et al.
patent: 6661083 (2003-12-01), Lee et al.
patent: 6995459 (2006-02-01), Lee et al.
patent: 2002/0163015 (2002-11-01), Lee et al.
patent: 2004/0080025 (2004-04-01), Kasahara et al.
patent: 2007/0210422 (2007-09-01), Chow et al.
patent: 2008/0142936 (2008-06-01), Yilmaz et al.
patent: 2009/0014851 (2009-01-01), Choi et al.
patent: 2009/0152691 (2009-06-01), Nguyen et al.

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