4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Kouhei Tatumi

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Production of small metal bumps

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Transfer of flux onto electrodes and production of bumps on elec

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent

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Profile ID: LFUS-PAI-P-1633052

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