Production of small metal bumps

Details Production of small metal bumps Production of small metal bumps

1996-07-09

1998-06-16

Bradley, P. Austin

Metal fusion bonding

Process

Preplacing solid filler

228253, 228 41, 228 19, B23K 100, B23K 3102

Patent

active

057657440

ABSTRACT:
A process of producing small metal bumps includes the steps of simultaneously holding small metal balls on an arrangement baseplate in the positions corresponding to those of electrodes of a semiconductor chip, a film carrier, or a substrate; aligning the small metal balls held on the arrangement baseplate with the electrodes; lightly pressing the small metal balls against the electrodes; to provisionally fix the balls to the electrodes; and pressing the provisionally fixed small metal balls to flatten the pressed surfaces of the small metal balls, and at the same time, to bond the small metal balls to the electrodes.

REFERENCES:
patent: 3589000 (1971-06-01), Galli
patent: 5172853 (1992-12-01), Maiwald
patent: 5275970 (1994-01-01), Itoh et al.
patent: 5289631 (1994-03-01), Koopman et al.
"Leveling Technique for Pads of Predeposited Solder," IBM Tech. Discl. Bull., vol. 32, No. 1, Jun. 1989, pp. 50-51.
"Dimensional Control of Plated Wiring Board Surface Solder Deposits," (Anonymous), Research Disclosure, Jan. 1992, No. 333.

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