Transfer of flux onto electrodes and production of bumps on elec

Details Transfer of flux onto electrodes and production of bumps on elec Transfer of flux onto electrodes and production of bumps on elec

1996-07-09

1999-05-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 36, 228106, B23K 120

Patent

active

058993762

ABSTRACT:
A process of transferring a flux on electrodes of a semiconductor chip, a film carrier, or a substrate, the process comprising: using a transfer apparatus including a transfer baseplate having protrusions corresponding to said electrodes; dipping the tips of the protrusions of the transfer baseplate in a flux bath to cause the flux to stick to the tips; then aligning the protrusions of the transfer baseplate with the electrodes; and transferring the stuck flux onto the electrodes from the tips.

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IBM Technical Disclosure Bulletin, vol. 34, No. 2, pp. 356-357, Jul. 1991.

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