Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-23
1999-08-10
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361774, 257697, 257737, 438613, 324755, 324757, H01L 2348, G01R 3102, H05K 702
Patent
active
059368454
ABSTRACT:
An IC package includes an IC chip substrate having a first surface on which a plurality of electrodes are formed, and an organic substrate having a first surface on which a plurality of bump electrodes are provided. The organic substrate is combined with the IC chip substrate. Each of the bump electrodes is in contact with a corresponding one of the electrodes on the IC chip substrate. The organic substrate has a plurality of through holes and metallization patterns electrically connecting each of the bump electrodes to a corresponding one of the through holes.
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Senba Naoji
Shimada Yuzo
Soejima Koji
Takahashi Nobuaki
NEC Corporation
Picard Leo P.
Vigushin John B.
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