IC package and IC probe card with organic substrate

Details IC package and IC probe card with organic substrate IC package and IC probe card with organic substrate

1997-06-23

1999-08-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361774, 257697, 257737, 438613, 324755, 324757, H01L 2348, G01R 3102, H05K 702

Patent

active

059368454

ABSTRACT:
An IC package includes an IC chip substrate having a first surface on which a plurality of electrodes are formed, and an organic substrate having a first surface on which a plurality of bump electrodes are provided. The organic substrate is combined with the IC chip substrate. Each of the bump electrodes is in contact with a corresponding one of the electrodes on the IC chip substrate. The organic substrate has a plurality of through holes and metallization patterns electrically connecting each of the bump electrodes to a corresponding one of the through holes.

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