4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Klaus-Peter Galuschki

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Electronic component mounted on a flat substrate and padded...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Electronic component mounted on a flat substrate and padded...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Method for producing a semiconductor device in chip format

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of padding an electronic component, mounted on a flat sub

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
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Semiconductor device in chip format and method for producing it

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1560532

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