Method of padding an electronic component, mounted on a flat sub

Details Method of padding an electronic component, mounted on a flat sub Method of padding an electronic component, mounted on a flat sub

1998-09-25

2000-05-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438106, 438125, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

060571780

ABSTRACT:
A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.

REFERENCES:
patent: 5328060 (1994-07-01), Kersten et al.
patent: 5697148 (1997-12-01), Lance, Jr. et al.
patent: 5731223 (1998-03-01), Padmanabhan

Affiliated with

Also associated with

Rating

Method of padding an electronic component, mounted on a flat sub does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of padding an electronic component, mounted on a flat sub, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of padding an electronic component, mounted on a flat sub will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1593184