4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Kiyofumi Yamamoto

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Device and method for joining substrates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Lens unit and compact image pickup module

Optical: systems and elements – Lens – With support
Reexamination Certificate

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Solid state imaging device and manufacturing method thereof

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Solid state imaging device and producing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Solid state imaging device and producing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2281608

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