4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Keshav B. Prasad

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Selective plating method for forming integral via and wiring lay

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Semiconductor package with chip redistribution interposer

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-1220674

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