Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1994-07-18
1995-10-03
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361712, H01L 2302
Patent
active
054553873
ABSTRACT:
An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.
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Caulfield Thomas
Crowley Sean T.
Hoffman Paul R.
Prasad Keshav B.
Cyrix Corporation
Horgan Christopher
International Business Machines - Corporation
Olin Corporation
Picard Leo P.
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