4. Metal treatment
  5. Barrier layer stock material, p-n type
  6. With non-semiconductive coating thereon

Kenneth M. Hays

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Etch control seal for dissolved wafer micromachining process

Metal treatment – Barrier layer stock material – p-n type – With non-semiconductive coating thereon
Patent

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Etch control seal for dissolved wafer process

Metal treatment – Barrier layer stock material – p-n type – With non-semiconductive coating thereon
Patent

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Heating elements with reduced stray magnetic field emissions

Electric heating – Heating devices – With heating unit structure
Reexamination Certificate

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Method of anodic wafer bonding

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
Patent

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