4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Wire lead bonder

Kenneth John Lubert

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Method for forming a multi-layered circuitized substrate member

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Wire maze penetrating apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-1274606

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