Method for forming a multi-layered circuitized substrate member

Details Method for forming a multi-layered circuitized substrate member Method for forming a multi-layered circuitized substrate member

1996-06-14

1998-10-27

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 97, H05K 336

Patent

active

058273867

ABSTRACT:
The ends of thru-holes, disposed in components that are laminated together to form a composite structure are masked prior to lamination of the components to prevent bonding material bleed through the holes during the lamination process. The method effectively solves the problem of the need to remove laminate bleed from the outer surface of the composite structure after the joining process.

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