Wire maze penetrating apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

29203B, 228 51, H05K 332

Patent

active

039891780

ABSTRACT:
Apparatus operative in conjunction with a wire routing and bonding machine, or the like, to selectively penetrate a maze of parallel wires on a printed circuit board and expose an area on the board so that additional wires may be suitably bonded to the exposed area. Utilizing the pressure it experiences when contacting the board surface, the apparatus operates to avoid damage to the printed circuit board surface and at the same time has a high reliability for clearing of wires from the selected area.

REFERENCES:
patent: 2850737 (1958-09-01), Walsh
patent: 3425114 (1969-02-01), Fellenzer, Jr.
patent: 3734386 (1973-05-01), Hazel
Steranko, "High-Density Bonding Tweezers," IBM Technical Disclosure Bulletin, vol. 10, No. 5, pp. 630-631 (1967).

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