Packing structure for container for semiconductor wafer and pack

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer

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Details

206592, 206594, 206721, B65D 8538, B65D 8590

Patent

active

057069514

ABSTRACT:
A packing structure for a container for containing semiconductor wafers is disclosed. The packing structure comprises a polypropylene box, and upper and lower pressing members for sandwiching the container for containing semiconductor wafers, wherein both the upper and lower pressing members comprise an olefinic resin.

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