Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-01-18
2011-01-18
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S686000, C257S723000, C257SE23051
Reexamination Certificate
active
07872335
ABSTRACT:
Methods and apparatus for integrated circuit (IC) packages with improved thermal performance and input/output capabilities are described. An integrated circuit (IC) package includes a leadframe, an IC die, a substrate having opposing first and second surfaces, a first wirebond, and a second wirebond. The leadframe includes a die attach pad having opposing first and second surfaces and a plurality of leads that emanate in an outward direction from the die attach pad. The IC die is coupled to the first surface of the die attach pad. The substrate is coupled to the die attach pad. Contact pads on the first surface of the substrate are electrically connected to bond fingers on the second surface of the substrate. The first wirebond couples a first bond pad on a first surface of the IC die to a bond finger on the second surface of the substrate. The second wirebond couples a second bond pad on the first surface of the IC die to a lead of the plurality of leads.
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Khan Reza-ur Rahman
Wang Ken Jian Ming
Broadcom Corporation
Parekh Nitin
Sterne Kessler Goldstein & Fox PLLC
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