4. Chemistry: electrical and wave energy
  5. Processes and products

Keisuke Yamanishi

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Copper foil for printed circuits

Stock material or miscellaneous articles – Composite – Of metal
Patent

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Copper foil for printed circuits and process for producing the s

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
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Surface treatment method of a copper foil for printed circuits

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
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Treatment of copper foil for printed circuits

Chemistry: electrical and wave energy – Processes and products
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Profile ID: LFUS-PAI-P-84325

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