Treatment of copper foil for printed circuits

Details Treatment of copper foil for printed circuits Treatment of copper foil for printed circuits

1990-04-27

1991-05-28

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 351, 204 44, C25D 358, C25D 706

Patent

active

050192221

ABSTRACT:
A process for the treatment of a copper foil for printed circuits comprises forming, over the surface of the copper foil to be treated, of an electroplating alloy deposit selected from the group consisting of electroplating deposits of binary alloys composed of 20-40 mg/dm.sup.2 copper and 100-3000 .mu.g/dm.sup.2 cobalt and of ternary alloys of 20-40 mg/dm.sup.2 copper, 100-3000 .mu.g/dm.sup.2 cobalt, and 100-1000 .mu.g/dm.sup.2 nickel. The copper foil treated has heat resistance, peel strength, and resistance to hydrochloric acid comparable to the Cu-Ni-treated foils. It can be etched with a CuCl.sub.2 etchant to form 150 .mu.m or finer-pitch printed circuits and is also etchable with alkalies. Its magnetizability is below the permissible upper limit.

REFERENCES:
patent: 4131517 (1978-12-01), Mitsuo

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